The world is changing as quickly as a wink. AMD and Intel have already begun working on the new-gen chips that should leverage the AI. Recently, we also learned that several tech hegemonies have reached an agreement. According to it, Samsung, Ericsson, IBM and Intel will be jointly researching and developing next-generation chips. The U.S. National Science Foundation (NSF) is funding the collaboration and has given the tech giants $50 million as part of its “Future of Semiconductors” program.
The National Science Foundation and the four technology giants will cooperate in different fields to develop next-generation chips on the basis of “co-design”. Samsung, Ericsson, IBM, and Intel will join forces to work together on aspects including device performance, chip and system level, recyclability, environmental impact, and manufacturability.
According to NSF Director Sethuraman Panchanathan, ” Future semiconductors and microelectronics will require transdisciplinary research spanning materials, devices, and systems, as well as the engagement of the full spectrum of talent in the academic and industrial sectors.”
With a $50 million grant, the NSF aims for this partnership between Samsung, Ericsson, IBM, and Intel to “inform research needs, stimulate innovation, accelerate results to market, and prepare for the workforce of the future.”
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This initiative is part of a National Science Foundation Future of Semiconductors (FuSe) team grant. Under the plan, progress in developing new processes, materials, devices, and architectures has been hampered by independent development. The program recognizes that there are significant opportunities to advance computing technology and reduce the cost of its application through co-development. “The goal […] is to foster a broad alliance of researchers from the science and engineering communities”.
The foundation believes that a holistic, co-design approach can accelerate the development of “high-performance, robust, safe, compact, energy-efficient and cost-effective solutions.”