TSMC will begin mass production of the next-generation 3nm chips on Thursday, December 29, according to the new report from DigiTimes, in line with reports earlier this year that mass production of the 3nm chips would begin at end of 2022.
From the report:
TSMC is scheduled to hold a ceremony at Fab 18 at Taiwan Southern Science Park (STSP) on December 29 to mark the start of commercial production of chips using 3nm process technology. The pure-play foundry will also detail plans to expand 3nm chip production at the fab, according to sources at semiconductor companies.
Apple will use the 3nm process of TSMC for its M2 Pro chip
Apple will be the primary customer of the new process, which could be used for the first time in the upcoming M2 Pro and M2 Max chips expected to power future MacBook Pro and Mac mini models arriving in 2023.
Apple is currently using TSMC’s 4nm process in the A16 Bionic chip in the iPhone 14 Pro series but could jump to 3nm as early as next year. A report in August claimed the upcoming M2 Pro chips would be the first to be based on the 3nm process. The M2 Pro chip is expected to debut first on the updated 14-inch and 16-inch MacBook Pros early next year and could be updated with Mac Studio and Mac mini models.
By the end of 2023, according to another report, the third generation of Apple silicon, the M3 and A17 Bionic chips for the iPhone 15, which will be based on TSMC’s enhanced 3nm process, is yet to be delivered. According to a DigiTimes report today, citing industry sources, 3nm chip production is “not likely to ramp up” until enhanced version production gets underway.
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