A few days ago, Redmi officially announced the Redmi K50 flagship series will be officially unleashed on March 17. The slogan of the conference is “Exceeding imagination”.
Well, the launch date mentioned above also means that the manufacturer will be actively promoting the upcoming smartphone series. That’s why we are getting a few posters daily. Say, today’s poster shows that our protagonists will be “the world’s first Dimensity 8100 and the world’s second Dimensity 9000” phones. They will provide not only flagship-level performance but also low power consumption.
Other than that, the second poster published today says that the Redmi K50 series will be the world’s first to support the new generation of “Bluetooth 5.3”. The latter boasts a lower latency, is more friendly to game scenarios, and has lower power consumption and stronger anti-interference ability. What’s more important, it supports the new LC3 audio encoding.
But this handset will be amazing not only internally but also externally. The company uses a new “nano-microcrystalline process” to restore the beauty of the “Olivine Meteorite” meteorite.
Prior to this, we learned that the Redmi K50 series will have three models: Redmi K50, Redmi K50 Pro, and Redmi K50 Pro+. They will be powered by the Snapdragon 870, Dimensity 8100, and Dimensity 9000 chips, respectively. Officially, the Dimensity 9000 will reach its peak.
Among the various models, the Redmi K50 Pro+ will provide an outstanding gaming performance. It can reach 59 frames in the 60-minute experience of “Genshin Impact”. So after the mentioned test time, it will reach the temperature of only 46 degrees. The performance and energy efficiency are more advantageous than those of the Snapdragon 8. Not accidentally, it could reach 1.04 million in AnTuTu. In GeekBench, this version got 1310 points and 4493 points in the single-core and multi-core tests, respectively.
As for the Dimensity 8100 version, it has managed to appear in GeekBench today. According to the screenshot, the phone scores 932 points and 3690 points in the single-core and multi-core tests, respectively.
In addition, the machine will also be equipped with a new generation of stainless steel VC heat dissipation, with a cooling area of 3950m2, and the main board coverage area is as high as 72%.
Apart from Redmi’s official Weibo channel, we could learn about its features from Lu Weibing’s page as well. He said that the Redmi K50 series will create a comprehensive experience upgrade, including upgrades in connection, power consumption, vibration, and positioning.
This series will boast a dual-frequency GPS, NFC, infrared remote control, and X-axis motor.