Last month, Redmi released the highest-end Redmi K50 e-sports version, the first model in the Redmi K50 universe. On March 17, the company will uncover the rest of the smartphones from this lineup. The new product launch conference comes with the slogan “Exceeding the imagination”. So we guess, at the launch event, we will see many innovative technologies and not only. Today, the company’s official Weibo page revealed a lot of information concerning various models of the series.
Dimensity Series Chips
Previously, Lu Weibing said that the Dimensity 9000 and the Dimensity 8100 will debut on the same stage. If nothing accidental happens, the Redmi K50 models will be the world’s first to launch these chips.
Earlier today, a Weibo blogger released the AnTuTu running score of the Redmi K50 Ultra. This phone is indeed equipped with the Dimensity 9000 platform, and the running score easily exceeded one million points, reaching 1,041,818 points. Among them, the CPU score is 265,743, the GPU score is 394,078, the MEM score is 189,740, and the UX score is 192,257.
By the way, the Dimensity 9000 adopts the combination of TSMC’s 4nm process + Armv9 architecture. It has a 3.05GHz Arm Cortex-X2 super core, three 2.85GHz Arm Cortex-A710 large cores, and 4 Arm Cortex-A510 small cores.
Apart from this, when the blogger shared the screenshot, some users found that its horizontal pixels are 1440, indicating that the Redmi K50 Ultra is likely to use a 2560*1440 resolution (2K) screen.
But the information referring to the Dimensity chips does not come from unofficial sources only. Today, Redmi said that one of the models will sport the Dimensity 9000 chip. We guess it would be the Redmi K50 Ultra. After running Genshin Impact for 1 hour, it can achieve a frame rate performance of 59fps, which is very close to full-frame performance. Moreover, the body temperature is 46 ℃, which is really suitable for playing games for a long time.
In addition to the Dimensity 9000, the Redmi K50 series will also launch a Dimensity 8100 model. We guess it should be the Redmi K50 Pro.
The Dimensity 8100 is composed of 4 Cortex A78 large cores clocked at 2.85GHz and 4 Cortex A55 small cores clocked at 2.0GHz. It also integrates the G610 MC6 GPU, which surpasses Snapdragon 888 in performance.
Cooling system
We are not talking about a gaming smartphone. But the Redmi K50 Ultra will be ideal for playing mobile games as well. For this, the Dimensity chip inside the phone is coupled with the ice cooling and several adjustments tailored by the project R&D team. Thus, on the basis of the good power consumption performance of the Dimensity 9000, the Redmi team has further optimized the cooling technology of the whole machine.
According to the official introduction, the Redmi K50 Dimensity version uses the same stainless steel VC soaking plate as the e-sports version, and has a large area of 3950m2, with a motherboard coverage rate of 72%.
This VC soaking plate adopts a T-shaped structure, and a larger area is used to cover the main board part. The thermal circuit design is more reasonable than before.
Already Passed Various Certifications
The aforementioned Weibo tipster also said that the L11R had passed the global certification. From the corresponding documents, we can see that inside its slim body, the phone will still carry a 4500mAh battery with a 67W fast charging support.
By the way, this should refer to the vanilla version, which is assumed to come with the old good Snapdragon 870 chip. The latter is known for its good power consumption.
The phone will also run the MIUI 13 of the box.
